Heat-Laminated P(VDF-TrFE) Piezoelectric Sensors for Rigid and Textile Substrates

Abstract

The rising interest in wearable technologies over the years has been fueled by the development of innovative electronic devices. However, their integration into human-electronic systems still presents challenges. For example, the integration of sensing elements onto electronic systems requires the optimization of fabrication processes. This study evaluates the integration of flexible piezoelectric sensors onto rigid and soft surfaces. The sensors were fabricated using PEDOT:PSS as electrodes and P(VDF-TrFE) as the active layer. The devices were laminated onto commercial rigid printed circuit boards (PCBs) and fabric to evaluate their application in functional expansion and wearable electronics. The lamination process was performed at temperatures near the Curie temperature of P(VDF-TrFE) (100°C). The results showed a reduction in ferroelectric and piezoelectric properties. Samples laminated on PCB showed a reduction of 44% in remanent polarization (Pr), while samples laminated on fabric showed a reduction of 33%. Laminated samples exhibited piezoelectric response; however, sensitivity (d33) measurements showed significant increase due to multiaxial mode bending deformation. Likewise, voltage output (Vout) measurements showed a reduction of 97% for samples laminated on PCB, while samples laminated on fabric showed an increase of 200%. These results demonstrate that heat lamination has potential as an integration method for wearable sensor systems.