Flip Chip Attachement on Rigid Substrates Using Anisotropics Conductive Adhesive Films

Tässä tietueessa ei ole kokotekstiä saatavilla Treposta, ainoastaan metadata.

Seppälä, A.

Tampere University of Technology

2003

Sähkötekniikan osasto - Department of Elecrical Engineering

This publication is copyrighted. You may download, display and print it for Your own personal use. Commercial use is prohibited.