Performance evaluation of joint cooling and information transmission for on-board communications
Volkova, Anna (2015)
2015
Master's Degree Programme in Electrical Engineering
Tieto- ja sähkötekniikan tiedekunta - Faculty of Computing and Electrical Engineering
This publication is copyrighted. You may download, display and print it for Your own personal use. Commercial use is prohibited.
Hyväksymispäivämäärä
2015-09-09
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:tty-201508281566
https://urn.fi/URN:NBN:fi:tty-201508281566
Tiivistelmä
Progress of hardware components provides the growth of computer performance ap-proximately every decade. Along with increasing complexity of computer components, there is also the trend to miniaturization. All these imply the need in new ways of com-ponents interconnections with efficient interface communications inside modern com-puters. On the other hand, the progress of hardware components and miniaturization result to the rise of heat release. New ways of cooling are constantly developing for modern computers, including laptops, tablets and smartphones. However, not all of them are efficient enough.
Having communications and cooling systems separately often makes it impossible to miniaturize a computer device. In order to succeed in this direction, the combination of both systems is needed. The new system should not only allow the hybrid design, but also provide efficient cooling and information transmission.
In this thesis, the statement of efficient joint cooling and information transmission is described. System design, the choice of necessary materials, properties of signal propa-gation and performance evaluation of the results for cooling and data transfer are pro-vided in the thesis.
It is shown that the terahertz frequency range is the most suitable for the information exchange between hardware components as it could provide extremely high data rates. However, it requires specific conditions for proper performance including non-absorbing materials.
A system based on heat pipes is proposed. The heat pipes, working as a cooling system as well as a waveguide, have cooling medium inside and metal casing. Cooling medium and metal casing should satisfy both cooling and transmission requirements. The best choice of cooling medium is a refrigerant, especially isobutane, as it does not have ab-sorption and provides the best cooling properties. The best casing is copper as it ensures good reflectivity for the propagated signal and thermal conductivity for the heat trans-fer.
The results of the cooling evaluation are reached through MATLAB software calcula-tions. Transmission performance is calculated in the COMSOL Multiphysics simulation software. The results prove that the materials are chosen right and the system is efficient for the use in modern computers.
Having communications and cooling systems separately often makes it impossible to miniaturize a computer device. In order to succeed in this direction, the combination of both systems is needed. The new system should not only allow the hybrid design, but also provide efficient cooling and information transmission.
In this thesis, the statement of efficient joint cooling and information transmission is described. System design, the choice of necessary materials, properties of signal propa-gation and performance evaluation of the results for cooling and data transfer are pro-vided in the thesis.
It is shown that the terahertz frequency range is the most suitable for the information exchange between hardware components as it could provide extremely high data rates. However, it requires specific conditions for proper performance including non-absorbing materials.
A system based on heat pipes is proposed. The heat pipes, working as a cooling system as well as a waveguide, have cooling medium inside and metal casing. Cooling medium and metal casing should satisfy both cooling and transmission requirements. The best choice of cooling medium is a refrigerant, especially isobutane, as it does not have ab-sorption and provides the best cooling properties. The best casing is copper as it ensures good reflectivity for the propagated signal and thermal conductivity for the heat trans-fer.
The results of the cooling evaluation are reached through MATLAB software calcula-tions. Transmission performance is calculated in the COMSOL Multiphysics simulation software. The results prove that the materials are chosen right and the system is efficient for the use in modern computers.