Laser-Assisted Bonding Approach for Photonic Integration Processes
Vlasov, Aleksandr A.; Uusitalo, Topi; Lepukhov, Evgenii; Virtanen, Heikki; Ojanen, Samu-Pekka; Viheriälä, Jukka; Guina, Mircea (2023)
Vlasov, Aleksandr A.
Uusitalo, Topi
Lepukhov, Evgenii
Virtanen, Heikki
Ojanen, Samu-Pekka
Viheriälä, Jukka
Guina, Mircea
IEEE
2023
24th European Microelectronics and Packaging Conference, EMPC 2023
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Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:tuni-202408238264
https://urn.fi/URN:NBN:fi:tuni-202408238264
Kuvaus
Peer reviewed
Tiivistelmä
Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using silicon-photonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermal-induced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.
Kokoelmat
- TUNICRIS-julkaisut [18884]