Thermal Stability of a Fully Printed Ultra-Thin Organic Pre-Amplifier Circuit Meant for on-Skin applications

Lataukset:

Kujansuu, Aregaw

Shiwaku, Rei

Sekine, Tomohito

Matsui, Hiroyuki

Tokito, Shizuo

Mäntysalo, Matti

Laurila, Mika-Matti

IEEE

2023

2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

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Peer reviewed