Additive Manufactured Compliant Surface Reflectance Sensor

Salo, Teemu; Luukko, Maija; Halme, Aki; Vanhala, Jukka (2023-08-28)
 
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Salo, Teemu
Luukko, Maija
Halme, Aki
Vanhala, Jukka
IEEE
28.08.2023


2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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doi:10.1109/FLEPS57599.2023.10220374
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https://urn.fi/URN:NBN:fi:tuni-202309057951

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In this paper1, we present an additive manufacturing (AM) method to implement structural electronics using an off-the-shelf fused deposition modeling (FDM) 3D printer with thermoplastic polyurethane (TPU) filament, conductive silver ink, and electronics components in standard packages. As a demonstrator, a surface reflectance sensor has been implemented. The structure consists of several 3D-printed TPU layers, 3D channels for the conductors, and cavities for components. A comparison is made between the performance of a traditional implementation on rigid PCB and the new sensor. The study shows that the chosen approach can be used for AM structural electronics.
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