"Ebefors, Thorbjörn" - Selaus tekijän mukaan TUNICRIS-julkaisut

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    • Inkjet printing technology for increasing the I/O density of 3D TSV interposers 

      Khorramdel, Behnam; Liljeholm, Jessica; Laurila, Mika-Matti; Lammi, Toni; Mårtensson, Gustaf; Ebefors, Thorbjörn; Niklaus, Frank; Mäntysalo, Matti (10.04.2017)
      article
      Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, ...